No.1, Xinan 5th Street, Xinan Village, Shijie Town, Dongguan, Guangdong, China.


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  Advanced PCBs are commonly used in high-precision electronic devices. With the continuous development of technology, the demand is also getting higher and higher. To this end, the separate advanced PCB production workshop is opened to assist our customers achieve the best possible time to market and competitive advantage by producing PCBs in a sustainable way at the lowest total price through our fabrication capabilities, delivery punctuality and product quality.

Advanced PCB From Prototype to Volume Production Multi-layer PCB (6-60 layers)
High Speed Signal Transmission
Rigid-Flex PCB
Impedance control PCB

What is HDI PCB

  High density interconnects (HDI) PCB is characterized by high density features, including laser micro vias, fine lines, and high-performance thin materials. This increased density can support more functions per unit area. because of its higher circuit density than normal PCBs, the design of HDI PCB can incorporate finer lines and spacing, smaller through holes and pads, and higher connection with pad density. HDI PCBs have blind vias and buried vias, and generally contain micro vias with a diameter of 0.006 or less.

  By using HDI technology, designers now can place more components on both sides of the raw PCB if desired. Now as the development of via in pad and blind via technology, it allows designers to place smaller components closer together. This means faster transmission of signals and a significant reduction in signal loss and crossing delays.

  HDI PCB is frequently found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices.

The advantages and applications of HDI technology.

-Compact design

  The combination of micro vias, blind vias, and buried vias greatly reduces board space. With the support of HDI technology, a standard 8-layer through-hole PCB can be simplified into a 4-layer HDI PCB but with the same functions.

  The birth of HDI PCB brings more possibilities for portable electronic devices and also brings more challenges to PCB manufacturers. In order to adapt to the miniaturization and multi-function trend of electronic products, AFASTPCB has made a lot of efforts to improve the level of equipment and the professional level of employees. You can provide us with HDI design, we will provide you with satisfactory services and HDI products.

We have the ability to manufacture up to 50layers of HDI PCB in various capabilities, please check the table below for the available HDI PCB capabilities:

Feature Capability
Quality Grade IPC Class 2,IPC Class 3,Automotive Standard,Customer Standard
Number of Layers 4-50 layer
Quality Grade IPC 6012 Class 2,IPC 6012 Class 3
Order Quantity 1 piece
Material Tg 140°C FR4,Tg 150°C FR4,Tg 170°C FR4 ,Tg 250°C FR4Special material
Thickness 0.21-6.3mm
Min Track/Spacing 2.5/2.5mil
Min Hole Size 0.078mm
Solder Mask Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green
Silkscreen White, Black,Yellow,Blue
Surface Finish Immersion gold,OSP,Hard gold,Immersion Silver
Finished Copper 0.5-13oz
Build time 5-10 days
Lead tim 2-3 days

Buried blind pore plate

  High Frequency / Microwave

  Blue rubber plate

  Metal Core / Metal Base

  Carbon oil plate

Advanced PCB Standard PCB
Application Industrial equipments, instrumentation, automotive electronics, communication equipments, etc. Finished products require high reliability and stable quality for users Children's toys, small appliances, home lighting, functional testing, electronic enthusiasts, etc. Suitable for users whose prices are core competitiveness
Production individual working panel mixed working panel
Quantity ≥1 piece 5,10,15,20,25...pieces
Material Shengyi,Rogers,Arlon,Isola,Omega,Dupont, Panasonic,3M etc. Meet IPC4101 class B/L Common Fr4 Meet IPC4101 class B/L
PCB Type High Frequency PCB,
Flexible&Ridid-flex PCB,
HDI&Buried and Blind PCB(HDI fird order to seven order) Multilayer
Common FR4 1-10 Layer
Board Size Min 5mm*6mm | Max 609*1100mm Min 5mm*6mm | Max 609*1100mm
Build Time 5-20 days (Expedited Service) 1-7 days (Expedited Service)
Ink,Soldermasks NAYA(LP-4G),         TAIYO(RSR2200),                      Tamura(TT19G)                           IPC-SM-840 class T TAIYO Meet IPC-SM-840 class T
Solder Mask Color Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green Green, Red, Blue, Black
Silkscreen Color White, Black White
Surface Finish Lead Free HASL - RoHS Lead Free HASL - RoHS
HASL - Hot Air Solder Leveling HASL - Hot Air Solder Leveling
ENIG - Electroless Nickle/Immersion Gold – RoHS  ENIG - Electroless Nickle/Immersion Gold –RoHS
Gold Plating Gold Plating
Immersion Ag Immersion Ag
Immersion Sn Immersion Sn
过孔处理 树脂塞孔,压接孔….
Min Tracing/Spacing 2.5/2.5MIL 5/5MIL
Max Copper weight 6oz 2oz
drilling Min Mechanical Hole Size 0.15mm,Laser hole 0.078mm Min Mechanical Hole Size 0.2mm
plating PTH (Hole copper thickness≥20um),IPC 3(25um) PTH(Hole copper thickness≥18um)
Soldermask offset ±2mil ±3mil
Dimensional deviation ±0.13mm ±0.2mm
Warping angle 75% 1%
Glass transition ℃  >150℃ >140℃
Test method A.O.I,Kelvin Four-terminal sensing,Microsection Inspection,Solderability Test,Impedance Test… A.O.I.,Fly Probe Testing
Standard IPC Glass 2
IPC Class 3,
Automotive Standard,
Customer Standard
IPC Class 2
No.1, Xinan 5th Street, Xinan Village, Shijie Town, Dongguan, Guangdong, China.
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